Company: ANSYS
About Company : Founded in 1970, ANSYS employs nearly 3,000 professionals, many of whom are expert M.S. and Ph.D.-level engineers in finite element analysis, computational fluid dynamics, electronics, semiconductors, embedded software and design optimization. Our exceptional staff is passionate about pushing the limits of world-class simulation technology so our customers can turn their design concepts into successful, innovative products faster and at lower cost.
Website: www.ansys.com
Eligibility: Masters Degree
Experience: 1 – 3 yrs
Location: Pune
Job Role: Application Engineer
Job Description:
1. Responsible for using professional experience and engineering knowledge and communications skills to help customers solving advanced technology problems.
2. Creates and presents best-in-class simulation flows and solutions for solving customers’ complex engineering problems by collaborating across diverse teams.
3. Work independently to analyze technical needs, requirements, and state of a customers’ current infrastructure, operations, and engineering workflows.
4. Responsible for articulating ANSYS’ value proposition which may encompass its entire suite of products; the presentations must affirm the sales message, differentiate ANSYS, and leave a strong and positive impression to audiences which can include senior company executives.
5. Participate in internal company activities to further enhance SI/PI/EMI simulation solutions, marketing, and professional growth.
6. Conduct beginner and/or intermediate training in the use of ANSYS SI/PI/EMI simulation software.
7. Communicate with R&D and product managers at ANSYS headquarters to provide feedback on customer requirements, submit software defects, and understand product status and development plan.
Education: Masters Degree in electronics, information, or communication
Experience: 1 – 3 years of experience in high frequency electromagnetic field or high-speed circuit design and simulation.
Required Skills:
1. Familiar with semi-conductor industry. Have full experience about chip, package, and PCB.
2. Familiar with SPICE circuit simulation, electromagnetic field calculation and signal time-frequency domain analysis, familiar with DDR3/4/5, PCIE, USB3.0, MIPI and other high-speed serial parallel bus and high-performance SERDES I/O technology, have chip packaging and high-speed PCB simulation and verification experience.
3. Ability to use oscilloscope, TDR, VNA and spectrum analyzer to correlate simulation results with laboratory measurements is preferred.
4. Experience with ANSYS-related software or other commercial CAE and EDA simulation packages, such as ADS, HSPICE, CST, HFSS, SIwave, PowerSI, HyperLynx, or other SI/PI/EMI simulation tools.
5. Basic programing experience, familiar with Python, VBS and other scripting languages.
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